The DDR5 overclocking series products provide high-performance one click overclocking technology solutions through XMP3.0 specifications. The selection and application of DRAM chips are strictly screened to meet customers' gaming performance requirements. Multiple heat sink design solutions are provided for customers to choose from and use, and a full process customized supply solution can be provided according to customer needs.
Scope Of Application：Esports computer
| Data bus：32-bit x2 with two independent sub channels | Interface：288PIN SODIMM |
| Architecture：1Rx8/2Rx8 | Voltage：XMP 1.2~1.55V / JEDEC 1.1V |
| Operating Temperature：0℃ to 70 ℃ (Tcase) | Storage temperature：-55℃ to 100℃ |
| Size：133.35(+0.45/-0.15)mm x 31.25(+0.55/-0.15) mm x 1.27 ± 0.1 mm | Compliance：RoHS 2.0 |
| Overclocking protocol：XMP3.0 | |
| Speed：6000XMP/6400XMP | CL：CL28~CL38 (XMP delay） |
| Banks：x8 32 Banks (8 Bank Groups) | Address：A0~A16 Max. |
| PMIC：2+1 Channal Power management on module | PMIC Support：2.05V Max.（Not locking voltage） |
| ODE：On-die ECC function | SBR：Same-Bank Refresh mode |
| ODT：Expand CA / CS signal ODT | BL：16n-bit pre-fetch architecture |
| PCB Layer：10 Layer Max. | RoHS：All of Lead-Free products are compliant for RoHS |
HOGE STORAGE: Deeply Rooted in Storage, Leading the Data Future
