The DDR5 RGB series products adopt a specially designed architecture and provide a one click overclocking technology solution with high-performance additional RGB light effect modules through XMP3.0 specifications. The selection and application of DRAM chips are strictly screened to meet customers' gaming performance requirements. Multiple heat dissipation chip design solutions are provided for customers to choose from and use, and a full process customized supply solution can be provided according to customer needs.
Scope Of Application：Esports computer
| Data bus：32-bit x2 with two independent sub channels | Interface：288PIN SODIMM |
| Architecture：1Rx8 | Voltage：XMP 1.2~1.55V / JEDEC 1.1V |
| Operating Temperature：0℃ to 70 ℃ (Tcase) | Storage temperature：-55℃ to 100℃ |
| Size：133.35(+0.45/-0.15)mm x 31.25(+0.55/-0.15) mm x 1.27 ± 0.1 mm | Overclocking protocol：XMP3.0 |
| Compliance：RoHS 2.0 | LED bus: 8LEDs linkage/16LEDs linkage (choose one) |
| RGB module: ENE MCU solution |
| Speed：6000XMP/6400XMP | CL：CL28~CL38 (XMP延迟） |
| Banks：x8 32 Banks (8 Bank Groups) | Address：A0~A16 Max. |
| PMIC：2+1 Channal Power management on module | PMIC Support: 2.05V Max.（不锁电压） |
| RGB：ENE MCU solution 8LEDs linkage/16LEDs linkage (choose one) | ODE：On-die ECC function |
| SBR：Same-Bank Refresh mode | ODT：Expand CA / CS signal ODT |
| BL：16n-bit pre-fetch architecture | PCB Layer：10 Layer Max. |
| RoHS：All of Lead-Free products are compliant for RoHS | |
HOGE STORAGE: Deeply Rooted in Storage, Leading the Data Future
