The DDR4 overclocking series products provide high-performance one click overclocking technology solutions through XMP2.0 specifications. The selection and application of DRAM chips are strictly screened to meet customers' gaming performance requirements. Multiple heat sink design solutions are provided for customers to choose from and use, and a full process customized supply solution can be provided according to customer needs.
Scope Of Application：Esports computer
| Data bus：64-bit DDR4 Unbuffered Non-ECC | Interface：288PIN UDIMM |
| Architecture：1Rx8/2Rx8 | Voltage：XMP 1.35V / JEDEC 1.2V |
| Operating Temperature：0℃ to 70 ℃ Max.(Tcase) | Storage temperature：-55℃ to 100℃ |
| Size：133.35 x 31.25（±0.15mm）x 1.4(±0.1mm) | Overclocking protocol：XMP2.0 |
| Speed：3200XMP/3600XMP | CL：CL16~CL18 （XMP Delay） |
| Banks：x8 16 Banks (4 Bank Groups) | Address：A0~A16 Max. |
| ODT：On Die Termination using ODT pin | CRC：Cyclic Redundancy Check for Read/Write data security |
| RoHS：All of Lead-Free products are compliant for RoHS | |
HOGE STORAGE: Deeply Rooted in Storage, Leading the Data Future
