The DDR4 RGB series products adopt a specially designed architecture and provide a one click overclocking technology solution with high-performance additional RGB light effect modules through XMP2.0 specifications. The selection and application of DRAM chips are strictly screened to meet customers' gaming performance requirements. Multiple heat dissipation chip design solutions are provided for customers to choose from and use, and a full process customized supply solution can be provided according to customer needs.
Scope Of Application：Esports computer
| Data bus：64-bit DDR4 Unbuffered Non-ECC | Interface：288PIN UDIMM |
| Architecture：2Rx8 | Voltage：XMP 1.35V / JEDEC 1.2V |
| Operating Temperature：0℃ to 70 ℃ Max.(Tcase) | Storage temperature：-55℃ to 100℃ |
| Size：133.35 x 31.25（±0.15mm）x 1.4(±0.1mm) | Overclocking protocol：XMP2.0 |
| RGB module: ENE MCU solution | LED bus: 8LEDs linked together |
| Speed：3600XMP | CL：CL16~CL18 （XMP delay） |
| RGB：ENE MCU scheme 8LEDs linkage | Banks：x8 16 Banks (4 Bank Groups) |
| Address：A0~A16 Max. | ODT：On Die Termination using ODT pin |
| CRC：Cyclic Redundancy Check for Read/Write data security | RoHS：All of Lead-Free products are compliant for RoHS |
HOGE STORAGE: Deeply Rooted in Storage, Leading the Data Future
