The HOGE B series standard DDR5 UDIMM fully adheres to JEDEC design specifications, using the latest selected DDR5 SDRAM storage chip and independent design version, providing a new generation of cost-effective architecture with lower power consumption and higher bandwidth cache function applications, good compatibility, stable performance and other characteristics.
Scope Of Application：Desktop computers, small workstations, edge computing machines, data acquisition devices
| Data bus：32-bit x2 with two independent sub channels | Interface：288PIN UDIMM |
| Architecture：1Rx8/2Rx8 | Voltage：VDD = VDDQ = 1.1V （-3%+6%） |
| Operating Temperature：0℃ to 70 ℃.(Tcase) | Storage temperature：-55℃ to 100℃ |
| Size：133.35(+0.45/-0.15)mm x 31.25(+0.55/-0.15) mm x 1.27 ± 0.1 mm | Compliance：RoHS 2.0 |
| Speed：4800Mbps/5600Mbps | CL：40x/46x |
| tCK：0.416ns/0.357ns | Timing：40-39-39/46-45-45 |
| VPP：1.8V | Banks：x8 32 Banks (8 Bank Groups) x16 16Banks (4 Bank Groups) |
| PMIC：2+1 Channal Power management on module | PMIC Support: 1.435V Max. |
| Address：A0~A16 Max. | SBR：Same-Bank Refresh mode |
| ODE：On-die ECC function | BL：16n-bit pre-fetch architecture |
| ODT：Expand CA / CS signal ODT | PCB Layer：10 Layer Max. |
| RoHS：All of Lead-Free products are compliant for RoHS |
HOGE STORAGE: Deeply Rooted in Storage, Leading the Data Future
