The HOGE B series standard DDR5 SODIMM fully adheres to JEDEC design specifications, using the latest selected DDR5 SDRAM storage chip and independent design version, providing a new generation of cost-effective architecture with lower power consumption and higher bandwidth cache function applications, good compatibility, stable performance and other characteristics.
Scope Of Application：Esports laptops, laptops, all-in-one machines, thin client machines, educational OPS, mobile industrial control computers, bank self-service terminals, cash register systems, network monitoring systems, traffic monitoring systems
| Data bus：32-bit x2 with two independent sub channels | Interface：262PIN SODIMM |
| Architecture：1Rx8/2Rx8 | Voltage：VDD = VDDQ = 1.1V （-3%+6%） |
| Operating Temperature：0℃ to 70 ℃ Max.(Tcase) | Storage temperature：-55℃ to 100℃ |
| Size：69.6±0.1mm x 30.0±0.15 mm x 1.2 ± 0.1 mm | Compliance：RoHS 2.0 |
| Speed：4800Mbps/5600Mbps | CL：40x/46x |
| tCK：0.416ns/0.357ns | Timing：40-39-39/46-45-45 |
Banks：x8 32 Banks (8 Bank Groups) x16 16Banks (4 Bank Groups) | VPP：1.8V |
| PMIC：2+1 Channal Power management on module | PMIC Support: 1.435V Max. |
| Address：A0~A16 Max. | SBR：Same-Bank Refresh mode |
| ODE：On-die ECC function | BL：16n-bit pre-fetch architecture |
| ODT：Expand CA / CS signal ODT | PCB Layer：10 Layer Max. |
| RoHS：All of Lead-Free products are compliant for RoHS | |
HOGE STORAGE: Deeply Rooted in Storage, Leading the Data Future
