The HOGE series M.2 PCIe 3.0 product is developed with a dedicated firmware version adapted to the characteristics of domestic platforms. It uses GD grade 3D Nand storage chips and cache free PCB design, with a read speed of up to 3500M/s and features wide compatibility, stability, and reliability, providing high-quality solutions for domestic alternatives.
Scope Of Application：Haiguang series platform/Loongson series platform/Feiteng series platform/Zhaoxin series platform
| Size：M.2 2280 PCIe 3.0 | Voltage：3.3V±5% |
| Warranty：3 Years | Interface：PCle Gen 3x4 Nvme1.3 |
| Operating temperature：0℃ ~ +70℃ | Capacity(GB)：128/256/512/1024/2048 |
| Storage temperature：-40℃ ~ +85℃ | Read/Write：3500/2500MB/s |
| Compliance：RoHS 2.0 |
| 1. Interface standard：PCle Gen 3x4 (backward compatible) | 2. Support dynamic power management |
| 3. Supports TRIM, NCQ, S.M.A.R.T | 4. Support dynamic bad block management and loss balancing |
| 5. Support garbage collection algorithm | 6. Support ECC error correction function |
HOGE STORAGE: Deeply Rooted in Storage, Leading the Data Future
