eMCP adopts MCP multi‑chip packaging technology, combining eMMC chip with low‑power DRAM. With the popularization of Android system, terminals have higher requirements for storage capacity. This product simplifies customer manufacturing process, reduces development cost, shortens terminal R&D cycle and speeds up product launch. Widely used in smartphones, smart wearables, educational electronics, smart speakers, network communication products and tablets.
Scope Of Application：Smartphones, smart wearables, educational electronics, smart speakers, network communication products, tablets
| Item | Specification |
| Product Form | eMMC + LPDDR4X 合封芯片 |
| Package Dimension (mm) | 11.5×13×1.0mm / 11.5×13×1.2mm |
| Max Sequential Read Speed | 320 MB/s |
| Max Sequential Write Speed | 260 MB/s |
| Capacity Combination (eMMC + DRAM) | 8GB+512MB、8GB+1GB、16GB+1GB、16GB+2GB、32GB+3GB、32GB+2GB、64GB+3GB、64GB+4GB、64GB+6GB、128GB+4GB、128GB+6GB |
| Operating Voltage (eMMC) | 1.2V、1.8V、3.3V |
| Operating Voltage (LPDDR4X) | VDD1=1.8V；VDD2=VDDCA=VDDQ=1.2V VDD1=1.8V；VDD2=1.1V；VDDQ=1.1V or 0.6V |
| Operating Temperature | -25℃ ~ +85℃ |
| Package Type | FBGA162、FBGA221、FBGA254 |
Multiple composite storage‑DRAM capacity combinations; Certified and compatible with mainstream chip platforms
HOGE STORAGE: Deeply Rooted in Storage, Leading the Data Future
