eMMC adopts all‑in‑one BGA package integrating flash memory and main controller, complies with JEDEC eMMC5.0/5.1 specification. Miniaturized package is highly compatible with mainstream hardware platforms. It has excellent read‑write performance for stable multi‑task processing, ensures smooth playback of high‑definition video and game operation. With high reliability, high performance and cost‑effective advantages, it is widely applied in various embedded system scenarios.
Scope Of Application：Smartphones, tablet computers, game consoles, set‑top boxes, smart wearables, video surveillance, smart home, smart speakers, network communication products and other embedded system devices
| DimensionTransmission Protocol: | EMMC5.1 |
| Capacity | 8-256GB |
| Read Speed (MB/s, Max) | 320MB/s |
| Write Speed (MB/s, Max): | 260MB/s |
| Temperature Range | -25°C~85°C |
| Operating Voltage | VCC:2.7V~3.6V;VCCQ:1.7V~1.95V |
| Size | 11.5X13.0mm |
Package type: FBGA153; Multiple package dimensions; Operating voltage VCC=3.3V, VCCQ=1.8V; Consumer grade operating temperature ‑25℃~85℃, industrial grade ‑40℃~85℃; Compatible with mainstream Qualcomm, MediaTek, Spreadtrum chip platforms
HOGE STORAGE: Deeply Rooted in Storage, Leading the Data Future
