The HOGE S series memory products are designed and developed specifically for domestic alternative solutions. They adopt the standard DDR5 JEDEC design specifications, carefully select high-quality DDR5 SDRAM memory chips, strictly adapt to domestic CPU architecture platforms, and provide stable, reliable, and high-performance memory technology solutions for innovative applications.
Scope Of Application：Haiguang 3450 platform/Feiteng D3000 platform
| Data bus：32-bit x2 with two independent sub channels | Interface：288PIN UDIMM DDR5 |
| Architecture：1Rx8 | Voltage：VDD = VDDQ = 1.1V （-3%+6%） |
| Operating Temperature：0℃ to 70 ℃ Max.(Tcase) | Storage temperature：-55℃ to 100℃ |
| Size：133.35(+0.45/-0.15)mm x 31.25(+0.55/-0.15) mm x 1.27 ± 0.1 mm | Compliance：RoHS 2.0 |
| Speed：5600Mbps | CL：46x |
| tCK：0.357ns | Timing：46-45-45 |
| VPP：1.8V | Banks：x8 32 Banks (8 Bank Groups) |
| PMIC：2+1 Channal Power management on module | PMIC Support: 1.435V Max. |
| Address：A0~A16 Max. | SBR：Same-Bank Refresh mode |
| ODE：On-die ECC function | BL：16n-bit pre-fetch architecture |
| ODT：Expand CA / CS signal ODT | PCB Layer：10 Layer Max. |
| RoHS：All of Lead-Free products are compliant for RoHS | |
HOGE STORAGE: Deeply Rooted in Storage, Leading the Data Future
