The HOGE series M.2 PCIe 3.0 product adopts GD grade 3D Nand storage chip and cache free PCB design, with a read speed of up to 3500M/s, supports dynamic power consumption ASPM, supports low-power L1.2, with power consumption as low as 1mW, and has the characteristics of wide compatibility, stability and reliability, providing high-quality solutions for complete machine customers.
Scope Of Application：Esports laptops, laptops, all-in-one machines, thin client machines, educational OPS, mobile industrial control computers, bank self-service terminals, cash register systems, network monitoring systems, traffic monitoring systems, etc
| Size：M.2 2280 PCIe 3.0 | Voltage：3.3V±5% |
| Warranty：3 Years | Interface：PCle Gen 3x4 Nvme1.3 |
| Operating temperature：0℃ ~ +70℃ | Capacity(GB)：128/256/512/1024/2048 |
| Storage temperature：-40℃ ~ +85℃ | Read/Write：3500/2500MB/s |
| Compliance：RoHS 2.0 |
| 1. Interface standard：PCle Gen 3x4 (backward compatible) | 2. Support dynamic power management |
| 3. Supports TRIM, NCQ, S.M.A.R.T | 4. Support dynamic bad block management and loss balancing |
| 5. Support garbage collection algorithm | 6. Support ECC error correction function |
HOGE STORAGE: Deeply Rooted in Storage, Leading the Data Future
