The HOGE Z series memory products adopt special design specifications and provide a cost-effective complete memory technology solution on the Intel platform architecture through independent technical solutions.
Scope Of Application:Intel series laptops, all-in-one computers, Mini PCs, etc
Data bus:64-bit DDR4 Unbuffered Non-ECC | Interface:260PIN SODIMM |
Architecture:1Rx4 | Voltage:VDD = VDDQ = 1.2V ± 60mV |
Operating Temperature:0℃ to 70℃(Tcase) | Storage temperature:-55℃ to 100℃ |
Size:69.6 x 30(±0.15mm)x 1.2(±0.1mm) | Compliance:RoHS 2.0 |
Speed:3200Mbps/2666Mbps | CL:22x/19x |
tCK:0.625ns/0.75ns | Timing:22-22-22/19-19-19 |
VPP:2.5V | Banks:x4 16 Banks (4 Bank Groups) |
Address:A0~A16 Max. | ODT:On Die Termination using ODT pin |
CRC:Cyclic Redundancy Check for Read/Write data security | RoHS:All of Lead-Free products are compliant for RoHS |